on front I-line exposure (MA6) |
|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
|---|
| Material |
photoresist (category) |
|---|
| Min feature size |
1 µm |
|---|
| Sides processed |
either |
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| Wafer size |
|
|---|
| Equipment |
Karl Suss MA6 mask aligner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 75 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
|---|
