on front Contact front-front alignment (MA6) |
|
| Alignment side |
front |
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| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
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| Max field size |
150 mm |
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| Min feature size |
2 µm |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Karl Suss MA6 mask aligner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 75 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
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| Comments: |
|
