Process Hierarchy

on front
  Stylus profilometer step measurement
Batch size 1
Min feature size 2 µm
Sides processed either
Wafer size
Wafer size
Equipment Tencor P-1 Contact Profiler
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, alumina, Borofloat (Schott), Pyrex (Corning 7740), quartz (single crystal), sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm