on front Photoresist ashing |
|
| Etchant Solutions and their concentrations. |
oxygen |
|---|
| Sides processed |
either |
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| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Matrix 106 Resist Removal System |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
|---|
