|
| Batch sizes |
25 .. 200 mm: 4 |
|---|
| Etchant Solutions and their concentrations. |
acetone |
|---|
| Material |
photoresist (category) |
|---|
| Process duration |
10 min |
|---|
| Sides processed |
both |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Wet Bench |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
|---|
