Process Hierarchy

on front
  Wafer curvature measurement
Batch size 1
Sides inspected
The sides of the wafer inspected by the process
Temperature 25 °C
Wafer size
Wafer size
Equipment Tencor FLX-2320
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
aluminum ring, aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), quartz (single crystal), glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 2000 µm
  • Substrate thickness must be