on front Wafer curvature measurement |
|
| Batch size |
1 |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Tencor FLX-2320 |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
aluminum ring, aluminum plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), quartz (single crystal), glass (category), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |
|---|
| Comments: |
|
