Process Hierarchy

on front
  Sheet resistance measurement
Batch size 1
Current 0.453 mA
Measurement aspect resistivity
Measurement unit Ohm/square
Setup time 30 min
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment 4-Point Probe
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm
  • Resistivity measured at five locations per test wafer.