Process Hierarchy

  RCA clean
Batch size 25
Sides processed both
Temperature 85 °C
Wafer size
Wafer size
Equipment PFC bench
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1200 µm
  • Effective organic and metal contaminant surface cleaning process.