Process Hierarchy

  Anodic bonding (without alignment)
Process characteristics:
Pressure of process chamber during processing
Pressure of process chamber during processing
Second substrate side bonded
Second substrate side bonded*
Substrate side bonded
Substrate side bonded*
Alignment type
Method used to align materials to be bonded.
Ambient to which substrate is exposed during processing
Batch size 2
Second substrate diameter 100 mm
Second substrate materials Pyrex (Corning 7740), silicon
Second substrate thickness 300 .. 600 µm
Temperature 450 .. 500 °C
Voltage 1500 V
Wafer size
Wafer size
Equipment Karl Suss Bond aligner
  • Maximum bond stack height is 6mm
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm