Process Hierarchy

  Gold wet etch
Process characteristics:
Depth of material removed by etch process
Depth of material removed by etch process, must be 0 .. 0.1 µm
0 .. 0.1 µm
Mask materials
Materials that can be used to mask etching.
photoresist (category)
Material gold
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
gold: 1
Sides processed both
Wafer size
Wafer size
Equipment Wetbench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1500 µm