on front Optical Exposure |
|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
equal line space |
|---|
| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
|---|
| Min feature size |
2 µm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
EVG 420 Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 3000 µm |
|---|
