Process Hierarchy

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  Wafer curvature measurement with stress calculation
Batch size 1
Sides processed either
Wafer size
Wafer size
Equipment Flexus 2-300
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 800 µm
  • Must follow a previous wafer curvature measurement (which is indicated as the reference step).