Process Hierarchy

  Titanium surface treatment
Depth 100 nm
Etch rate 100 nm/min
Solutions and their concentrations.
NaOH/hydrogen peroxide
Material titanium
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
titanium: 1
Wafer size
Wafer size
Equipment Wetbench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1500 µm