on front Stylus profilometer step measurement |
|
| Batch size |
1 |
|---|
| Contact force Force applied at contact point |
5 mN |
|---|
| Depth |
2000 µm |
|---|
| Measurement aspect |
thickness |
|---|
| Measurement unit |
nm |
|---|
| Setup time |
20 min |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
KLA-Tencor Alpha-Step IQ surface profiler |
| Equipment characteristics: |
| MOS clean |
no |
|---|
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 100 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
irregular, other, rectangular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
0.3 .. 21 mm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), Pyrex (Corning 7740), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
0.3 .. 21 mm |
|---|
