Process Hierarchy

  Ultrasonic clean
Batch size 1
Process duration 5 min
Temperature 20 °C
Wafer size
Wafer size
Equipment Ultrasonic Cleaner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Borofloat (Schott), glass (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 500 µm