on front Spectrophotometric film thickness measurement |
|
| Batch size |
1 |
|---|
| Materials |
polysilicon, polysilicon (phosphorus doped), silicon nitride, silicon dioxide, phosphosilicate glass, zinc oxide |
|---|
| Measurement aspect |
thickness |
|---|
| Measurement unit |
Ang |
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| Refractive index |
1 .. 4 |
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| Setup time |
30 min |
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| Sides inspected The sides of the wafer inspected by the process |
either |
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| Thickness |
0 .. 50 µm |
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| Wafer size |
|
|---|
| Equipment |
NanoSpec Spectrophotometer |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
recessed platen |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 700 µm |
|---|
| Comments: |
|
