Process Hierarchy

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  Spectrophotometric film thickness measurement #2
Batch size 1
Materials silicon dioxide, silicon nitride, photoresist (negative) (category), polysilicon on silicon dioxide, photoresist (negative) on silicon dioxide, silicon nitride on silicon dioxide, polyimide (category), photoresist (positive) (category), photoresist (positive) in silicon dioxide
Process duration 3 min
Refractive index 0 .. 4
Sides processed either
Thickness 0.005 .. 50 µm
Wafer size
Wafer size
Equipment NanoSpec/AFT Model 210XP
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
recessed platen
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm