on front Spectrophotometric film thickness measurement #2 |
|
| Batch size |
1 |
|---|
| Materials |
silicon dioxide, silicon nitride, photoresist (negative) (category), polysilicon on silicon dioxide, photoresist (negative) on silicon dioxide, silicon nitride on silicon dioxide, polyimide (category), photoresist (positive) (category), photoresist (positive) in silicon dioxide |
|---|
| Process duration |
3 min |
|---|
| Refractive index |
0 .. 4 |
|---|
| Sides processed |
either |
|---|
| Thickness |
0.005 .. 50 µm |
|---|
| Wafer size |
|
|---|
| Equipment |
NanoSpec/AFT Model 210XP |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
recessed platen |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
