Process Hierarchy

on front
  Stylus profilometer step measurement
Batch size 1
Contact force
Force applied at contact point
50 mgf
Max vertical travel 65 µm
Min feature size 50 µm
Min vertical travel 0.01 µm
Process duration 3 min
Sides processed either
Wafer size
Wafer size
Equipment Dektak IIA
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), gallium arsenide, sapphire, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm