on front Stylus profilometer step measurement |
|
| Batch size |
1 |
|---|
| Contact force Force applied at contact point |
50 mgf |
|---|
| Max vertical travel |
65 µm |
|---|
| Min feature size |
50 µm |
|---|
| Min vertical travel |
0.01 µm |
|---|
| Process duration |
3 min |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Dektak IIA |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
plastic chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category), gallium arsenide, sapphire, silicon on sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
