Process Hierarchy

on front
  Wafer curvature measurement with stress calculation
Batch size 1
Process duration 10 min
Sides processed either
Wafer size
Wafer size
Equipment SMSI 3800
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, gallium arsenide, germanium, gallium phosphide
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 13000 µm
  • Must follow a previous wafer curvature measurement (which is indicated as the reference step).