Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Chip encapsulation
Process characteristics:
Encapsulation material
Specify preferred epoxy encapsulation material (if known).
Encapsulation material
Specify preferred epoxy encapsulation material (if known).
Equipment