Process Hierarchy

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  Spectroscopic ellipsometry film thickness measurement
Batch size 5
Materials aluminum oxide, chromium, gold, polyimide CG 284, aluminum, tungsten hexasilicide, polyimide (category), silicon nitride, silicon, silicon dioxide, titanium oxide, amorphous silicon, tantalum oxide, PMMA, 950K PMMA, phosphosilicate glass (low temperature), 496K PMMA, polysilicon
Measurement aspect thickness
Measurement unit nm
Sides processed either
Thickness 0.01 .. 5 µm
Wafer size
Wafer size
Equipment Leitz SP
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, gallium arsenide, silicon on insulator, indium phosphide, sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
0.1 .. 10000 µm
  • Film thickness measured by reflectance ellipsometry using an accurate materials database.
  • Knowledge of layers present at the area(s) to be measured and best guess at thickness.