Process Hierarchy

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  Stylus profilometer 1-D step measurement
Contact force
Force applied at contact point
5 mN
Depth 0 .. 1000 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Max field size 20 mm
Sides processed either
Wafer size
Wafer size
Equipment KLA-Tencor P-15 stylus profilometer
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), gallium arsenide, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm