Process Hierarchy

  HF dip
Process characteristics:
Etchant
Specify preferred HF solution (if known).
Etchant
Specify preferred HF solution (if known).
Process duration
Specify preferred dip time (if known).
Process duration
Specify preferred dip time (if known).
unconstrained
Sides processed both
Equipment
Comments:
  • Wet chemical solutions of hydrogen fluoride used specifically to remove native oxides on silicon.