Process Hierarchy

on front
  Optical surface profilometry
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Min feature size 1 µm
Sides inspected
The sides of the wafer inspected by the process
Vertical resolution
Maximum vertical resolution of profiler.
0.1 nm
Wafer size
Wafer size
Equipment Veeco NT3300 profilometer
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
0 .. 8 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular, other
Piece thickness
Range of wafer piece thickness the equipment can accept
0 .. 100 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
0 .. 100 mm
  • Minimum charge: $100