Process Hierarchy

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  Wafer curvature measurement
Batch size 1
Excluded materials gold (category), copper
Measurement unit MPa
Sides processed either
Wafer size
Wafer size
Equipment FSM 3800
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms