Process Hierarchy

  PMMA resist sheet bonding
Alignment type
Method used to align materials to be bonded.
Wafer size
Wafer size
Equipment Wetbench
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon carrier
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1500 µm
  • Used to bond one or more PMMA
    sheets to substrate.
  • If substrate surface topology
    >250um solvent bonding is used.