Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Thick film printing with low-temperature inks
Process characteristics:
Material
Ink material used for printing.
Material
Ink material used for printing.
Process duration
Fab enters the estimated processing time.
Process duration
Fab enters the estimated processing time., must be 1 .. 4 hour
1 .. 4 hour
Thickness
Thickness
must be 5 .. 15 µm
5 .. 15 µm
Batch size 1
Excluded materials gold (category), copper
Min feature size 4 mil
Temperature 110 °C
Wafer size
Wafer size
Equipment MPM TF-100
  • Can also print on macor, kapton, nylon, and teflon substrates.
Equipment characteristics:
MOS clean no
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 1000 µm
Comments:
  • The masks must be supplied by customer. CWRU can make masks only if that require features larger than 400um.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.