Process Hierarchy

on front
  EDX material analysis
Process characteristics:
must be 0.5 .. 40 hour
0.5 .. 40 hour
Batch size 1
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Hitachi S-4700 SEM
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
0 .. 4 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular, other
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 10000 µm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, germanium, glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), sapphire, silicon, Borofloat (Schott), silicon dioxide, silicon germanium, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 10000 µm
  • Layer to be inspected must be
    at least 100 nm thick.