Process Hierarchy

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  Optical surface profilometry
Batch size 1
Measurement aspect 3D topology
Measurement unit nm
Sides processed either
Thickness 0.001 .. 5000 µm
Wafer size
Wafer size
Equipment Zygo
  • Measurement may be impossible when thin transparent films are present. Inquire for details.
Equipment characteristics:
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 1000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), fused silica, glass (Hoya), Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm
  • White light interferometer.
  • Price is for up to two measurements. Additional measurements require additional pricing.