Process Hierarchy

on front
  Contact front-back alignment
Alignment side back
Alignment tolerance
Registration of CAD data to features on wafer
5 µm
Batch size 1
Excluded materials gold (category), copper
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Field geometry
Shape of field with dimensions characterized by the maximum field size
Max field size 90 mm
Min feature size 2 µm
Sides processed either
Wafer size
Wafer size
Equipment Karl Suss MA6
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon dioxide, alumina
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms