on front Stylus profilometer step measurement |
|
| Batch size |
1 |
|---|
| Contact force Force applied at contact point |
0.01 .. 0.4 mN |
|---|
| Depth |
100 µm |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Measurement unit |
angstrom, micron |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Veeco Dektak 3030ST |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Borofloat (Schott), alumina, quartz (single crystal) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 40000 µm |
|---|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
