Process Hierarchy

on front
  Lift-off etch (1112A)
Batch size 1
Depth 2.7 µm
Solutions and their concentrations.
Shipley Remover 1112A
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Material Shipley 1827
Min feature size 5 µm
Sides processed either
Temperature 80 °C
Wafer size
Wafer size
Equipment Silicon organic wet bench
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
  • Patterned photoresist and metal layer.