Process Hierarchy

on front
  Stylus profilometer step measurement Down
Batch size 1
Contact force
Force applied at contact point
5 mN
Depth 160 µm
Measurement aspect thickness
Measurement unit nm
Setup time 30 min
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Tencor Alphastep 200 Unavailable
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm
  • One step height measurement per pallet.