Process Hierarchy

  Photoresist develop (Shipley 1827)
Batch size 1
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
Material Shipley 1827
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
Shipley 1827: 1
Sides processed both
Temperature 25 °C
Wafer size
Wafer size
Equipment Wet bench
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 75 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular, other
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm