on front Contact front-front alignment & exposure |
|
| Alignment side |
front |
|---|
| Alignment tolerance Registration of CAD data to features on wafer |
0.5 µm |
|---|
| Batch size |
1 |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Max field size |
4 inch |
|---|
| Min feature size |
1 µm |
|---|
| Process duration |
11 min |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Karl Suss MA6 Contact Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
glass plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, glass (category), quartz (single crystal), silicon, silicon on insulator, silicon on sapphire |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 4000 µm |
|---|
| Comments: |
|
