Process Hierarchy

on front
  Wafer curvature measurement
Batch size 1
Measurement unit MPa
Sides processed either
Wafer size
Wafer size
Equipment Tencor Flexus
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
aluminum ring
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm