The MEMS and Nanotechnology Exchange is pleased to announce the release of Molecular Vapor Deposition process modules from the Microfabrication Laboratory at UC Berkeley. Molecular Vapor Deposition (MVD) is the preferred technique for reproducible and controllable deposition of monomolecular coatings on exposed MEMS device surfaces. The recently installed and tested tool at UC Berkeley (Applied Microstructures MVD100) integrates in-situ surface preparation via downstream oxygen plasma treatment and temperature and pressure controlled delivery of vapor phase organosilane precursors.

Qualified processes are MVD of FOTS (fluorooctyltrichlorosilane) and MVD of DDMS (dimethyldichlorosilane). FOTS produces a hydrophobic fluorinated surface layer; water contact angle of FOTS modified silicon or silicon dioxide layers is 110 degrees. DDMS produces a hydrophobic methylated surface layer; water contact angle of DDMS modified silicon or silicon dioxide layers is 101 degrees. Both FOTS and DDMS treatments decrease the coefficient of friction and the work of adhesion of exposed MEMS moving parts. These treatments have been shown to increase yield and reliability of microengine components in controlled comparison tests performed at Sandia National Laboratories.

More information about these process modules can be found in the MEMS and Nanotechnology Exchange process catalog (See: MVD of FOTS, MVD of DDMS) or by contacting the MEMS and Nanotechnology Exchange at 703-262-5368 or email us at engineering@mems-exchange.org.

As a special one time offer to allow our customers to test out this exciting new process capability, the MEMS and Nanotechnology Exchange in conjunction with the participating foundry will conduct a process run that will be made available to selected members of the domestic community at no cost (*). Parties interested in this opportunity will need to notify us of their interest by submitting the information in the form below by September 1, 2006.

Please fill out this form to request consideration for this free processing.

* 
Certain restrictions will apply to these no-cost process offerings. The term no-cost only refers to the actual MEMS or Nano processing work performed by the foundry. Customers will be required to pay for the cost for any special substrates, integrated circuits processes, shipping, and any additional services provided.
1)
Contact Information
Contact name
Phone number
Company
Street
City
State/province
Country
Postal/ZIP code
2)
Email


3)
Are you a DoD organization?

yesno

4)
Are you a DoD/DARPA contractor?

yesno

5)
Are you a MEMS Exchange customer?

yesno

6)
In what area of MEMS device development are you or your organization primarily involved?

e.g., inertial sensors for aerospace applications using MEMS device made using DRIE and integrating these MEMS devices with electronics


7)
Please state the reason for your interest in this module. What problems do you think that the process module(s) may solve?


8)
DARPA and the MEMS Exchange are very interested in having the customers of these process modules share any information about how well the process module worked for them, including any resultant data from experiments and testing derived from devices fabricated using these process modules. Would you be willing to share any such information or feedback about your experience with the process module(s) with DARPA and/or the MEMS Exchange?

yesno

9)
What kind of testing are you intending to perform?