The image is a colorized Scanning Electron Micrograph (SEM) of a high-aspect ratio MEMS device fabricated out of single-crystal silicon by the MEMS and Nanotechnology Exchange fabrication network. The device itself is made from a Silicon-On-Insulator (SOI) wafer where a relatively thick single-crystal silicon device layer (shown in yellow and blue in the image) has been etched into a complex micromechanical element that can move under force. The underlying area, shown in red in the image, is the SOI handle wafer which also has been etched to form a circular hole completely through the substrate. This image demonstrates the complexity of micromechanical devices that can be realized using the MEMS and Nanotechnology Exchange.