Heidelberg VPG200++

Model VPG 200+
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1
File formats
List of CAD file formats supported (eg. GDSII, CIF)
Mask plate dimensions
Width, length, thickness of the mask plates (eg. 5x7x0.09 inch).
200mm x 200mm
Max field size 200 mm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 150 mm, 200 mm
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm