Model 650 Hot-Filament Diamond Deposition System |
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| Model | Model 650 |
| Type | commercial |
| Comments | |
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| Equipment Characteristics | |
| Batch sizes | 100 mm: 9, 150 mm: 4, 200 mm: 1, 300 mm: 1 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 .. 300 nm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |
| Attachments | |
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