Ultratech XLS200 4X stepper

Model XLS200
Type commercial
Equipment Characteristics
Batch sizes 150 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Corning Eagle 2000, silicon, Corning 1737, silicon on insulator, quartz (fused silica)
Wafer thickness
List or range of wafer thicknesses the tool can accept
500 .. 900 µm