Ultratech NanoTech 160 1X stepper
Model NanoTech 160
Type commercial
Comments
  • The NanoTech 160 is Ultratech's second-generation dual side alignment (DSA) stepper utilizing Direct Vision technology. The NanoTech 160 is specifically designed for applications where exposing both the front and backside of the wafer is necessary. Based on its patented Machine Vision System (MVS), Direct Vision incorporates an alignment system capable of aligning to targets on the back of the wafer while exposing features on the front.
  • The NanoTech 160 offers valuable process enhancement features, including a robotic wafer handler, pre-aligner and chuck exclusively designed to handle dual side resist coated wafers with no backside contamination. The handling system is designed to support substrate thicknesses up to 1.2 mm thick and unique software and hardware features have been developed to address the requirements of extremely thick resist processes. In addition, a Windows based PC controller offers increased flexibility through a variety of alignment and focus options for improved process performance for dual side alignment applications.
  • Key Features and Benefits:
  • * Front and backside alignment capability
    * Non-contact lithography
    * Ability to place multiple lithography layers on a single reticle
    * Pattern recognition alignment system (MVS) eliminates the need for dedicated targets
    * High wafer plane irradiance
    * Simple integration with existing processes
    * Compact system footprint
    * A proven projection lithography platform in semiconductor, thin film head and microsystems production environments
Equipment Characteristics
Batch sizes 150 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 150 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 fused silica, Corning Eagle 2000, silicon, Corning 1737, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 250 .. 1000 µm