JEOL 6000 FSE |
|
|---|---|
| Model | 6000 FSE |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 2 .. 100 mm: 1 |
| Beam spot diameter Area of the beam used to write the mask |
3 .. 250 nm |
| Max field size | 50 .. 800 µm |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 100 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 600 µm |