Wet bench

Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), silicon carbide, silicon on insulator, quartz (single crystal), sapphire, silicon, Pyrex (Corning 7740), gallium arsenide, indium phosphide
Wafer thickness
List or range of wafer thicknesses the tool can accept
250 .. 800 µm