Flip chip bonder |
|
|---|---|
| Alternate Name | Flip chip bonder |
| Manufacturer | MRSI |
| Model | 503M |
| Type | commercial |
| Equipment Characteristics | |
| MOS clean | no |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |