MicroAutomation dicing saw

Alternate Name Dicing Saw
Manufacturer MicroAutomation
Model T1100
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 125 mm: 1, 50 mm: 1, 75 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm, 125 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, polyethylene, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm