Vapor Priming Oven

Alternate Name Yes Oven
Manufacturer YES
Model 58SM Vapor Priming Oven
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 125 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm