STS advanced oxide etcher

Model MESC Multiplex ICP system
Type commercial
  • Wafers or wafer pieces smaller than 100mm in diamater, need to be mounted on another full wafer using thermal paste. In these cases, the batch size may vary depending on the shape and size of the pieces.
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 4, 75 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
helium clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), fused silica, glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), silicon on insulator